Semiconductors: Tanaka’s Groundbreaking Bonding Technology Unveiled

Semiconductors: Tanaka’s Groundbreaking Bonding Technology Unveiled

TechWizard Unveils Tanaka’s Breakthrough in Semiconductor Bonding

In a groundbreaking development, Tanaka Kikinzoku Kogyo, a renowned Japanese developer of industrial precious metals products, has introduced a cutting-edge gold particle bonding technology that revolutionizes high-density mounting of semiconductors. This innovative technology leverages Tanaka’s AuRoFUSE low-temperature fired paste for gold-to-gold bonding, enabling the miniaturization of semiconductor wiring and enhancing integration for various types of chips, including LEDs and semiconductor lasers (LDs).

AuRoFUSE is a unique composition of submicron-sized gold particles and a solvent that forms a bonding material with low electrical resistance and high thermal conductivity, facilitating metal bonding at low temperatures. By utilizing AuRoFUSE preforms (dried paste forms), this advanced technology can achieve 4 μm fine-pitch mounting with 20 μm bumps, showcasing its precision and efficiency.

Through a thermocompression bonding process involving 20 MPa at 200°C for 10 seconds, AuRoFUSE preforms exhibit a compression of approximately 10 percent in the compressive direction while maintaining minimal deformation in the horizontal direction. This exceptional bonding strength makes them ideal for practical applications, serving as reliable gold bumps for semiconductor devices. Moreover, with gold as the primary component, AuRoFUSE preforms offer outstanding chemical stability, ensuring long-term reliability after mounting.

Tanaka is set to showcase this groundbreaking technology at the upcoming 38th Spring Conference of the Japan Institute of Electronics Packaging, scheduled to take place from March 13 to 15, 2024, at the prestigious Tokyo University of Science. This presentation will provide industry experts and tech enthusiasts with a firsthand look at the potential of Tanaka’s semiconductor bonding technology and its implications for future advancements in the field.

This remarkable achievement by Tanaka Kikinzoku Kogyo underscores the company’s commitment to innovation and excellence in the realm of semiconductor technology. By pushing the boundaries of traditional bonding methods and introducing a state-of-the-art solution for high-density mounting, Tanaka is poised to make a significant impact on the semiconductor industry and pave the way for enhanced performance and efficiency in semiconductor devices.

As the tech community eagerly anticipates Tanaka’s presentation at the upcoming conference, the industry is abuzz with excitement over the potential applications and benefits of this groundbreaking semiconductor bonding technology. With its unparalleled precision, reliability, and efficiency, Tanaka’s AuRoFUSE technology is set to redefine the standards for semiconductor mounting and drive the next wave of innovation in the field.

Stay tuned for more updates and insights from TechWizard as we continue to explore the latest advancements and breakthroughs in the world of technology.